Monthly Archives: August 2011

Intelliconnect will be showing off their UK-manufactured 50Ω Coaxial and Triaxial RF connectors at European Microwave Week, 11-14 October in Manchester, UK. Intelliconnect can be found at stand number 618.

European test house Teseq has developed the NSG 3040-DDV generator which provides test waveforms for simulating Supply Dips, Drops and Variations. The new generator is the first in a series of single-function generators derived from the successful NSG 3040 family … Continue reading →

Solid State Supplies has won a UK and Ireland franchise with Quectel Wireless Solutions, a Chinese manufacturer of wireless communications modules for M2M applications.

AVX has expanded its HQ Series MLC surface mount RF power capacitors to include P90 dielectric versions for high power high frequency applications.

NXP has introduced the industry’s first no-offset I2C-bus buffers, which enable system designers to isolate capacitance and interface with other bus buffers.

Fujitsu Semiconductor Europe has expanded its line-up for instrument clusters with the introduction of the MB9EF126 ‘Calypso’. It’s  the first member of Fujitsu’ s FCR4 family of devices to be based on the ARM CortexTM-R4 core operating at up to … Continue reading →

TT electronics will be highlighting its range of innovative high-rel components and compliant services for military vehicle applications at the forthcoming DSEi event in London (13-16 September).  TT electronics’ stand, number S5-390, will feature examples of the very latest applications … Continue reading →

NXP has launched the first NWP ISO 11898-6 and AUTOSAR R3.2.1 compliant solution supporting CAN Partial Networking.

AT&T has approved u-blox’ LISA 3G wireless module for use on its mobile broadband network.

EBV Elektronik and CMOS image sensor company Aptina, a spin off from Micron, have announced a distribution agreement to promote and deliver Aptina products to customers in Europe, the Middle East and Africa.