CPI Card Group, a global leader in financial and commercial card production and related services, announced new initiatives with NXP Semiconductors and KSW Microtec to broaden its portfolio of contactless offerings and provide customers with expanded contactless technology solutions from two widely respected developers.
Demand for contactless cards in the financial payment card market has increased significantly over the past several years. Given this new partnership and years of global experience, CPI now offers additional qualified alternatives in the supply chain development of contactless payment cards to meet the growing marketplace demands.
NXP Semiconductors offers a broad portfolio of solutions for banking applications, providing customers with a combination of proven security and performance with their ICs. NXP’s Fast Pay contactless security chip, deployed with CPI, can be widely used for contactless payment applications and is specifically designed to provide consumers in the USA and Canada with a secure, fast and comfortable payment experience. It’s embedded Data Encryption Standard (DES) hardware co-processor and best-in-class contactless performance provides strong security and fast transaction times.
KSW Microtec is a leading supplier of contactless prelaminates for ePayment, eGovernment and Access Control applications. The KSW Thinlam®, a contactless prelaminate for card manufacturers, provides exceptional thinness and maintains the highest reliability and durability thanks to its unique assembly technology. Thinlam is the ideal solution for any contactless personal identification application especially where security, performance and appearance are important.